AWG G3 PAD FOR PS3 Dokumentacja Pobierz pdf (Strona 57)

System Reference, January 2001 57

4 Test Head Filling and DUT Board

Considerations

This chapter covers the DUT board structure and how to

equip the test head with digital boards and analog

modules.

The chapter is divided into the following four sections:

• “Overview of Test Heads” on page 59.

• “DUT Board Mechanical Considerations” on page 61

concerning the packaged parts DUT boards.

• “Test System Configuration” on page 70 from the view

of the packaged parts DUT boards. But note that most

of the information given in this section is also valid

for the wafer prober DUT boards.

• “Wafer Prober DUT Board and Probe Card” on

page 104.

You will be served with all information necessary to:

• know about filling options and filling of your test head

with analog modules.

• get an overview of the DUT board contacting schemes.

• read the nomenclature of the DUT board drawings for

future DUT board designs or changes.

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AWG G3 PAD FOR PS3 Dokumentacja Strona 57