AWG G3 PAD FOR PS3 Dokumentacja Pobierz pdf (Strona 95)

Test System Configuration 4 Test Head Filling and DUT Board Considerations

System Reference, January 2001

There are always three power pads ganged in one channel.

The available maximum current per channel is:

• 8 A for the GP DPS.

• 1 A for the HV DPS.

Not available on the wafer

prober DUT board

The trigger line TR+ is reserved for a measurement initia-

tion in a future extension.

VB+ is a so called voltage bump. VB+ is a hardware trig-

gered switch which allows you to change the voltage to a

different value. The advantage of a hardware controlled

switch rather than a software controlled switch is that the

point of time of the voltage change is well defined.

TRVB- is the ground of VB+ and TR+.

The pads in rows 4, 9 and 14 (small black dots) are Not

Connected (NC).

High Current DPS , Functional

Assignment of Pogo Pads

In Table 15, the functional assignment of the HC DPS pogo

pads is illustrated.

Table 15 Functional Assignment of the High Current DPS Pads

The HC DPS pogo pad blocks as sketched on the side of

Table 15 have less pogo pads. Those pads for the ground

(G) and the power lines (P) are larger in diameter and

Pogo Pad (Pin) No. a b

01 Current_Monitor G1

02 P1 V trig

03 V bump G1

04 P1 SAFETY_LINE

05 PS1 G1

06 P1 GS1

07 SGND G1

08 P1 +5V

Orientation Marker

on Housing

1 2 ... 90 91 92 93 94 95 96 97 98 99 100 ... 284 285

Brak uwag

AWG G3 PAD FOR PS3 Dokumentacja Strona 95